1/4 rev. a structure silicon monolithic integrated circuits product series bipolar stepping motor driver type bd6383efv function ? pwm constant current controllable two h bridge driver ? built-in translator circuit for clk-in control ? full, half, quarter step ? mixed decay control ? parallel in control absolute maximu m ratings(ta=25 ) item symbol limit unit supply voltage v cc0,1,2 -0.2 +36.0 v power dissipation pd 1.6 1 w 4.7 2 w input voltage for control pin v in -0.2 +5.5 v rnf maximum voltage v rnf 0.5 v maximum output current i out 1.0 3 a/phase operating temperature range t opr -25 +75 storage temperature range t stg -55 +150 junction temperature t jmax 150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 12.8mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 37.6mw/ for operating above ta=25 . 3 do not, however exceed pd, aso and tjmax=150 . recommended operating conditions (ta=-25 +75 ) item symbol min typ max unit supply voltage v cc0,1,2 10 24 28 v output current i out - 0.5 0.7 4 a/phase 4 do not, however exceed pd, aso. this product isn?t designed for protection against radioactive rays.
2/4 rev. a electrical characteristics (unless otherwise specified ta=25 , vcc0,1,2=24v) item symbol limit unit conditions min typ max whole circuit current at standby i ccst - 1.0 3.0 ma ps=l circuit current i cc - 4.5 10 ma ps=h, vrefx=2v control input (select, cw_ccw, cl k, ps, mode0, mode1, enable) h level input voltage v inh 2.0 - - v l level input voltage v inl - - 0.8 v h level input current i inh 35 50 85 a v in =5v l level input current i inl -10 0 - a v in =0v output (out1a, out1b, out2a, out2b) output on resistance r on - 1.50 1.95 i out =0.5a, sum of upper and lower output leak current i leak - - 10 a current control rnfxs input current i rnfs -2.0 -0.2 - a rnfxs =0v rnfx input current i rnf -40 -20 - a rnfx=0v vrefx input current i vref -2.0 -0.1 - a vrefx=0v vrefx input voltage range v ref 0 - 2.0 v mthx input current i mth -2.0 -0.1 - a mthx=0v mthx input voltage range v mth 0 - 3.5 v comparator threshold v cth 0.36 0.40 0.44 v vrefx=2v minimum on time t onmin 0.3 0.7 1.2 s r=39k ,c=1000pf
3/4 rev. a package outline block diagram pin no. / pin name pin no. pin name pin no. pin name 1 nc 21 vcc0 2 rnf1 22 nc 3 rnf1s 23 gnd 4 nc 24 mode0 5 out1b 25 mode1 6 nc 26 enable 7 out1a 27 vref2 8 nc 28 mth2 9 vcc1 29 nc 10 nc 30 cr2 11 cr1 31 nc 12 nc 32 vcc2 13 mth1 33 nc 14 vref1 34 out2a 15 select 35 nc 16 cw_ccw 36 out2b 17 nc 37 nc 18 clk 38 rnf2s 19 ps 39 rnf2 20 test 40 gnd nc : non connection bd6383ef v lot no. htssop-b40 (unit:mm) product no. predriver ocp current limit comp. buffer 9 vcc1 cr timer buffer current limit comp. logic translator dac ocp cr timer predriver dac logic tsd uvlo ovlo reg reset 23 gnd 27 vref2 30 cr2 28 mth2 21 vcc0 19 ps 18 cl k 24 mode0 25 mode1 11 cr1 13 mth1 16 cw_ccw 26 enable 15 select vref1 14 5 out1b 3 rnf1s 7 out1a 2 rnf1 32 vcc2 34 out2a 38 rnf2s 40 gnd 36 out2b 39 rnf2 20 test
4/4 rev. a operation notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temper ature range of operating conditions, etc., can break down the devices, thus ma king impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) power supply lines as return of current regenerated by back emf of mo tor happens, take steps such as putting capacitor between power supply and gnd as an electric pathway for the regenerated current. be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. if the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a physical safety measure such as the in sertion of a voltage clamp diode between the power supply and gnd pins (3) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (4) thermal design use a thermal design that allows for a sufficient marg in in light of the power dissipation (pd) in actual operating conditions. this ic exposes its frame of the backside of package. note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency . try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (5) actions in strong electromagnetic field use caution when using the ic in t he presence of a strong electromagnet ic field as doing so may cause the ic to malfunction. (6) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (7) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit). if the chip temperature becomes tjmax=150 , and higher, coil output to the motor will be open. the tsd circuit is designed only to shut the ic off to prevent runaway thermal operation. it is not designed to protect or indemnify peripheral equipment. do not use the tsd function to protect peripheral equipment. (8) ground wiring pattern when using both small signal and large current gnd pa tterns, it is recommended to isolate the two ground patterns, placing a single ground poi nt at the ground potent ial of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. (9) test pin be sure to connect test pin to gnd.
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